Features:
High-Quality Solder Paste for Phone Mainboard BGA SMD PCB Reballing Repair
Running tin is fast, less smoke
No-clean, easy to tin, no residue
Applicable to mobile phone PCB, BGA, and PGA rework
Net: 100g
Features:
High-Quality Solder Paste for Phone Mainboard BGA SMD PCB Reballing Repair
Running tin is fast, less smoke
No-clean, easy to tin, no residue
Applicable to mobile phone PCB, BGA, and PGA rework
Net: 100g
Product Specifications Material Flux Packaging Size 100gm Packaging box Features Suitable for multiple PCB reflow Brand AMTECH Product Description AMTECH NC-559-ASM 100g Soldering Flux Welding Paste Excellent capacity of solder-stickiness Excellent Anti-wet Capacity Widely used on BGA, PGA, CSP packages and flip chip operation Suitable for multiple PCB reflow No-clean and Lead free for environmental …
Amaoe 50g Soldering Paste For BGA Stencil Reballing Specification: Type: Solder Tin Paste Weight: 50g Model: M10 Low-Temperature Melting Point: 138℃ Medium-Temperature Melting Point: 183℃ High-Temperature Melting Point: 217℃ Great for BGA Stencil Reballing
Model : RMA-223-UV/NC-559-ASM Volume : 100 g / bottle It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. Feature : Excellent capacity of solder-stickiness Excellent Anti-wet Capacity …
DESCRIPTION REVIEWS (0) Strong tin drag, good conductivity, no cleaning. Good wettability, full solder joints, bright and even solder joints. Printing in PCB can still maintain its viscosity for a long time without deformation and collapse. For circuits with spacing of 0.3mm