Features:
High-Quality Solder Paste for Phone Mainboard BGA SMD PCB Reballing Repair
Running tin is fast, less smoke
No-clean, easy to tin, no residue
Applicable to mobile phone PCB, BGA, and PGA rework
Net: 100g
Features:
High-Quality Solder Paste for Phone Mainboard BGA SMD PCB Reballing Repair
Running tin is fast, less smoke
No-clean, easy to tin, no residue
Applicable to mobile phone PCB, BGA, and PGA rework
Net: 100g
Model : RMA-223-UV/NC-559-ASM Volume : 100 g / bottle It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. Feature : Excellent capacity of solder-stickiness Excellent Anti-wet Capacity …
Low Temperature SMT Lead-Free Solder Paste, Kaisi 138°C, 40G Description: Manufacturer: KAISI Country of origin: CN Yes, certification 138 DEGREE is the model number. Size of Particles: 20-38 m Name: SMT solder paste with high compatibility Melting point is 138 °C. 40G Specifications Environment for storage: 0–10°C one year Type 1 applicable: Circuit soldering Type …
KAISI 138°C LOW TEMPERATURE SMT LEAD FREE SOLDER PASTE – 40GRead More
Product Specifications Material Flux Packaging Size 100gm Packaging box Features Suitable for multiple PCB reflow Brand AMTECH Product Description AMTECH NC-559-ASM 100g Soldering Flux Welding Paste Excellent capacity of solder-stickiness Excellent Anti-wet Capacity Widely used on BGA, PGA, CSP packages and flip chip operation Suitable for multiple PCB reflow No-clean and Lead free for environmental …
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