Features:
The solder joints are bright and full/Less residue/Multiple styles to choose from
No virtual welding/No-clean/Climbing tin fast/Wide applicability
The solder joints are bright and full, with high resistance, strong activity, easy to weld, and are not prone to defects such as virtual soldering or false soldering
Moderate viscosity,no collapse or deviation: Tin paste is viscous and smooth, with small viscosity changes. It is suitable for surface mount components and is not prone to displacement
Scope of application:Engineering circuit maintenance, computer soldering, and PCB soldering, etc
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