Category: STENCILS
Showing 33–48 of 120 results
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JTX T4 Pro Universal Chips Glue Removal and Tin Planting Platform
Original price was: ₨ 4,600.00.₨ 4,500.00Current price is: ₨ 4,500.00.Add to cartUpgrade your mobile phone repair workstation with the JTX T4 Pro Universal Chips Glue Removal & Tin Planting Platform Set—a premium 2-in-1 reballing solution designed for professional technicians. This high-precision platform simplifies IC glue removal and solder ball reballing, making chip-level repairs faster, safer, and more accurate. Built with a durable magnetic clamping system and …
JTX T4 Pro Universal Chips Glue Removal and Tin Planting PlatformRead More
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mechanic solder ball for reballing process for CPU IC lavel 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm
₨ 550.00Add to cartMECHANIC solder ball 10000PCS/Bottle Our BGA solder ball has the following characteristics: . Meet EU ROHS and REACH standards. .With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance. . Purity and sphericity are very high, no surface defects. .Suitable for BGA, CSP and other cutting-edge packaging technology and the use of …
