JTX T4 Pro Universal Chips Glue Removal and Tin Planting Platform

Upgrade your mobile phone repair workstation with the JTX T4 Pro Universal Chips Glue Removal & Tin Planting Platform Set—a premium 2-in-1 reballing solution designed for professional technicians. This high-precision platform simplifies IC glue removal and solder ball reballing, making chip-level repairs faster, safer, and more accurate.

Built with a durable magnetic clamping system and precision positioning technology, the T4 Pro securely holds CPU, RAM, and EMMC chips during the repair process, minimizing the risk of chip damage while improving work efficiency. The included universal 3D reballing stencils provide excellent alignment for clean and consistent solder ball placement.

Compatible with a wide range of smartphone chipsets, including Apple A8–A18 Pro, Qualcomm Snapdragon, MediaTek Dimensity, Samsung Exynos, Huawei HiSilicon, and various Android RAM BGA packages, this versatile platform supports up to 84 chip models, making it an essential tool for modern mobile repair professionals.

Key Features:
Professional 2-in-1 glue removal and IC reballing platform
Supports up to 84 popular smartphone chip models
High-strength magnetic automatic clamping system
Precision chip positioning for accurate and stable operation
Universal 3D reballing stencil design
Premium steel construction with excellent durability
Heat-resistant, anti-slip, shock-absorbing, and wear-resistant materials
Ideal for CPU, RAM, and EMMC chip repair
Compatible with iPhone, Samsung, Huawei, Xiaomi, OPPO, VIVO, Honor, and many Android devices
Package Includes:
1 × JTX T4 Pro Magnetic Reballing Platform
14 × Precision Reballing Stencils

Perfect for professional mobile repair technicians, chip-level engineers, and advanced electronics workshops looking for reliable, accurate, and efficient IC repair tools.