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RELIFE F-20 Advanced hydrogenated flux

 600.00

RELIFE F-20 Advanced Hydrogenated Flux is a professional-grade, no-clean soldering flux designed for precision electronic repair work. It uses advanced hydrogenated rosin technology, which ensures excellent solder wetting, smooth flow, and strong bonding during soldering.

This flux is specially made for BGA reballing, PCB repair, SMD component soldering, and mobile motherboard work. It helps remove oxidation from metal surfaces and improves solder adhesion, making solder joints clean, shiny, and reliable.

RELIFE F-20 produces low smoke, minimal residue, and no strong irritating smell, making it safe and comfortable for long repair sessions. Its no-clean formula means you usually don’t need extra cleaning after soldering.

Overall, it is a high-performance flux for technicians and electronics repair professionals, especially useful for delicate and precision soldering jobs.

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U-IP6 AMAOE BGA STENCILL IPXS-A12 FOR IPXS\MAX\XR 0.12MM

U-IP6 AMAOE BGA STENCILL IPXS-A12 FOR IPXS\MAX\XR 0.12MM

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Total  400.00