1.Configure needles and.Needle + push rod for easier to use.
2.Running tin is fast and has less smoke
3.No-clean, easy to tin, no residue
4.Applicable to mobile phone PCB, BGA and PGA repair
1.Configure needles and.Needle + push rod for easier to use.
2.Running tin is fast and has less smoke
3.No-clean, easy to tin, no residue
4.Applicable to mobile phone PCB, BGA and PGA repair
Product Specifications Material Flux Packaging Size 100gm Packaging box Features Suitable for multiple PCB reflow Brand AMTECH Product Description AMTECH NC-559-ASM 100g Soldering Flux Welding Paste Excellent capacity of solder-stickiness Excellent Anti-wet Capacity Widely used on BGA, PGA, CSP packages and flip chip operation Suitable for multiple PCB reflow No-clean and Lead free for environmental …
Model : RMA-223-UV/NC-559-ASM Volume : 100 g / bottle It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. Feature : Excellent capacity of solder-stickiness Excellent Anti-wet Capacity …
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