1.Highly effective removal of oxide layers, Quickly remove cyanide deposits from the soldering iron tip’s contact surface to restore its shine.
2.Restore soldering iron tips to achieve regeneration, enabling efficient repair and reuse.
1.Highly effective removal of oxide layers, Quickly remove cyanide deposits from the soldering iron tip’s contact surface to restore its shine.
2.Restore soldering iron tips to achieve regeneration, enabling efficient repair and reuse.
Model : RMA-223-UV/NC-559-ASM Volume : 100 g / bottle It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. Feature : Excellent capacity of solder-stickiness Excellent Anti-wet Capacity …
LB Rear Camera Cable 14PM
LB Rear Camera Cable 14pro
LB Universal WiFi Read/Write Module(with 210 WiFi small board)
LB H7 BGA 110 NAND Module
LB L3 Camera/radar repair expansion board 16 Series
WhatsApp us


