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UV flux 559

Original price was: ₨ 1,200.00.Current price is: ₨ 1,000.00.

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Model : RMA-223-UV/NC-559-ASM
Volume : 100 g / bottle

It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.

Feature :

Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead free for environmental protection

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 58,050.00

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Sub Total  58,050.00
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Total  58,050.00