YCS 199℃ solder paste

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  AMAOE PPD 183 DEGREE FOR IC REBALLING

  ₨ 650.00

  Amaoe 50g Soldering Paste For BGA Stencil Reballing Specification: Type: Solder Tin Paste Weight: 50g Model: M10 Low-Temperature Melting Point: 138℃ Medium-Temperature Melting Point: 183℃ High-Temperature Melting Point: 217℃ Great for BGA Stencil Reballing

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  Universal glue remover RL-518

  ₨ 500.00

  UNIVERSAL LIQUIC FOR FRAME RL-518 1. Suitable for many model China mobile ,for example R7/R7S/R7P/R9/R9P/R11/R11P/X6/X7/X7P/X9/X9SP/X20 etc. 2. Special effects on the PUR ,suitable for IP Xr/Xs/X/8/8P 3. The effect is significant, just a little can be effective, saving cost and time 4. no hurt the flex cable ,no hurt the Lcd ,no hurt the frame.

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  AMAOE PPD 138 DEGREE FOR MOBILE REPAIRING

  ₨ 700.00

  Product Information for Amaoe Solder Paste PPD M11 138°C The distinctions between our three varieties of solder paste and their uses at high, medium, and low temperatures are as follows:1, environmentally friendly high-temperature solder paste with silver and M9 lead-free 217°: Usage Advice: It is appropriate for the master who has strict standards for maintenance …

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  AMTECH NC-223 FLUX 100gm

  ₨ 1,000.00

  Product Information Packaging Flux Packaging 100gm Packaging box Features appropriate for many PCB reflows AMTECH Brand Product Information ASM 100g Soldering Flux Welding Paste, AMTECH NC-223, Excellent solder stickiness capacity Excellent resistance to moisture often used in flip chip operations, PGA, BGA, and CSP packages appropriate for many PCB reflows Lead-free and No-clean for the …

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