Category: STENCILS
Showing 33–48 of 119 results
-
mechanic solder ball for reballing process for CPU IC lavel 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm
₨ 550.00Add to cartMECHANIC solder ball 10000PCS/Bottle Our BGA solder ball has the following characteristics: . Meet EU ROHS and REACH standards. .With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance. . Purity and sphericity are very high, no surface defects. .Suitable for BGA, CSP and other cutting-edge packaging technology and the use of …
















