Mijing M-21 magnetic pad for middle layer reballing process to make more easy
₨ 1,700.00
The middle layer frame reballing platform of the Xiaomi M21 universal magnetic base mobile phone motherboard is described. For mobile phone logic board middle layer mid frame BGA, MiJing universal magnetic base with magnetic middle layer steel mesh stencil and scraper blade tin paste knife Tin planting maintenance.
Tin-planting with the Mijing GX01 GX02 non-magnetic tin paste scraper knife set for removing IC glue off motherboards.
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